Engineering break-through electronics: cooler, power saving by replacing solder with copper: 7x improved electrical & thermal conductivity.
Kuprion’s™ revolutionary, copper based nanotechnology is a highly electrically conductive material enabling a new generation of printable electronics and integrated circuit chips. Connections between chip-to-chip or chip-to-board are up to 10 times the electrical and thermal conductivity of existing materials - perfect for smaller and more powerful products from phones to electric cars. Our nanoCopper technology is based on work that began at Lockheed Martin in 2008. They were researching ways to replace traditional solder with a high-performance, RoHS- compliant alternative for high-power, high-reliability applications. With widespread interest from the commercial sector, all rights and patents were transferred to Kuprion in 2019 to commercialize the family of pastes and inks. Since then, Kuprion has garnered Fortune 100 customers, 20 patents, and VC funding with offices and manufacturing in San Jose, CA
Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
---|---|---|---|---|---|---|
Mar 29, 2019 | Series A | $5M | 5 | Alsop Louie Partners | — | Detail |
Dec 27, 2016 | Seed | — | — | — | — | Detail |
Investor Name | Lead Investor | Funding Round |
---|---|---|
Alsop Louie Partners | Yes | Series A |
LiteCap | — | Series A |
Dolby Family Ventures | — | Series A |
Levensohn Venture Partners | — | Series A |
Startup Capital Ventures | — | Series A |