TransDimension products will expand on this base, leveraging our expertise in embedded systems connectivity.
TransDimension makes integrated circuits, Internet protocol cores, software stacks and development tools that enable direct wired and wireless interconnectivity for a wide range of applications and mobile devices.
Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
---|---|---|---|---|---|---|
Jul 2, 2004 | Series C | — | 1 | — | — | Detail |
Investor Name | Lead Investor | Funding Round |
---|---|---|
Rolling Oaks Capital | — | Series C |